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High-voltage LDMOSFET devices having polysilicon trench-type guard rings

机译:具有多晶硅沟槽型保护环的高压LDMOSFET器件

摘要

A high-voltage semiconductor device including a semiconductor layer formed on a substrate is provided. A first well region having a first conductivity type and a second well region having a second conductivity type are formed in the semiconductor layer. Source and drain regions are respectively formed in the first and second well regions. A gate structure is disposed on the semiconductor layer. A first isolation trench structure is disposed in the semiconductor layer and surrounds the first and second well regions. The first isolation trench structure includes a first polysilicon layer filling a first trench and having the second conductivity type, a first heavy doping region formed in an upper portion of the first polysilicon layer and having the second conductivity type, and a first insulating liner disposed on sidewalls of the first trench and surrounding the first polysilicon layer.
机译:提供了一种高压半导体器件,其包括形成在基板上的半导体层。在半导体层中形成具有第一导电类型的第一阱区域和具有第二导电类型的第二阱区域。源极区和漏极区分别形成在第一阱区和第二阱区中。栅极结构设置在半导体层上。第一隔离沟槽结构设置在半导体层中并且围绕第一阱区和第二阱区。第一隔离沟槽结构包括填充第一沟槽并具有第二导电类型的第一多晶硅层,形成在第一多晶硅层的上部并具有第二导电类型的第一重掺杂区以及设置在其上的第一绝缘衬里第一沟槽的侧壁并围绕第一多晶硅层。

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