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Design and characterization of polysilicon TFT devices, circuits and systems for large area flexible electronic applications.

机译:用于大面积柔性电子应用的多晶硅TFT器件,电路和系统的设计和表征。

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摘要

Polysilicon TFT technology shown to be an excellent alternative to amorphous silicon technology for high performance, high quality and low power, small and mid size flat panel mobile displays. Reliable performance of polysilicon TFT electronics made it the potential technology of choice for several other large area matrix-based applications such as transducers and sensors as well.;This dissertation addresses various aspects of the design and characterization of polysilicon thin film transistor (TFT) electronics with the main focus on development of large area systems on flexible platform. This includes evaluation of polysilicon TFT devices on stainless steel foil as far as scalability, matching, uniformity, stability and their comparability with devices on rigid platform. At a higher level this work addresses the design and performance characterization of pixel circuits for matrix based systems. Two distinct applications of actuators and sensors are considered in this part. A high voltage, high current TFT device is engineered to be a part of the pixel circuit of a matrix-based actuator system (that is used for printing applications). Double and triple gate TFT devices are structured to withstand OFF-state drain to source voltage of more that 35V while capable of providing 50mA of current at ON-state. Furthermore voltage noise of lateral polysilicon PIN diodes which are employed as part of the pixel circuit of a thermal sensing system is also studied. It is demonstrated through experiments that voltage noise of PIN diodes are strongly depends on the polysilicon grain size and quality. Additionally, voltage noise also relates to the thickness of the polysilicon as the active material. As the grain size decreases the voltage noise of PIN diodes tends to increase however as the thickness of the active material increases cause the voltage noise to decrease. Furthermore, voltage noise strongly depends on the i-region width and length; it tends to increase with increasing i-region length and to decrease with increasing i-region width. Methods to improve the voltage noise of lateral polysilicon PIN diodes are also proposed and experiment results are revealed.;This effort also demonstrates several electronic circuits to be used as scanning, controlling and processing circuit blocks of large area electronic systems utilizing polysilicon TFT technology. Exploiting polysilicon TFT assets, these circuit blocks improve upon existing digital, analog and mixed signal circuits while complying with the limitations of polysilicon TFT as a novel technology as well as flexible substrates. High performance circuits including 3-bit flash analog to digital converter, 5-bit R-2R digital to analog converter, Full-bit shift registers, decoders and 21 different adder cells are demonstrated with SLS polysilicon TFT technology on stainless steel foil substrate. Furthermore design and development of a 4-bit Harvard structure microprocessor (CPU) as well as a high gain operational amplifier with polysilicon TFT technology are also discussed. These circuits can be integrated on the same monolithic substrate as the large area system to improve the system integration level.;Finally this work addresses the effect of mechanical strain on the performance of polysilicon TFT devices and ring oscillators on flexible steel foil substrate. Majority of flexible electronic applications require considerable amount of flexibility and conformability which may lead to substantial amount of stress on electronic circuits. We have realized that as the longitudinal mechanical tensile (compressive) strain increases mobility of n-type TFTs increases (decreases) and that of p-type decreases (increases). Propagation delay of ring oscillators on the other hand tends to drop with tensile and increase with compressive strain, almost linearly. Realizing the effect of mechanical strain on the performance flexible polysilicon TFT electronics potentially aid to find solutions to compensate for unwanted changes.;The main objective of this endeavor is to further advance the polysilicon TFT technology and demonstrate its capabilities and also prove its compatibility with variety of substrates by successful development of polysilicon TFT devices, circuits and systems, for different applications, on unconventional rigid (quartz) as well as flexible (stainless steel foil) platforms.
机译:对于高性能,高质量和低功耗的中小型平板移动显示器,多晶硅TFT技术被证明是非晶硅技术的绝佳替代品。多晶硅TFT电子产品的可靠性能使其成为其他几种基于大面积矩阵的应用(例如换能器和传感器)的潜在技术选择。;本论文解决了多晶硅薄膜晶体管(TFT)电子产品的设计和表征的各个方面主要致力于在灵活平台上开发大面积系统。这包括对不锈钢箔上的多晶硅TFT器件的可扩展性,匹配性,均匀性,稳定性及其与刚性平台上的器件的可比性的评估。在更高的层次上,这项工作解决了基于矩阵的系统的像素电路的设计和性能表征。本部分考虑了执行器和传感器的两种不同应用。高电压,大电流TFT器件被设计为基于矩阵的致动器系统(用于打印应用)的像素电路的一部分。双栅极和三栅极TFT器件的结构可承受OFF状态的漏极至源极电压超过35V的电压,同时能够在ON状态提供50mA的电流。此外,还研究了横向多晶硅PIN二极管的电压噪声,该二极管被用作热感测系统的像素电路的一部分。通过实验证明,PIN二极管的电压噪声在很大程度上取决于多晶硅的晶粒尺寸和质量。另外,电压噪声还与作为活性材料的多晶硅的厚度有关。随着晶粒尺寸减小,PIN二极管的电压噪声趋于增加,然而,随着活性材料的厚度增加,导致电压噪声减小。此外,电压噪声在很大程度上取决于i区域的宽度和长度。它倾向于随着i区域长度的增加而增加,并且随着i区域宽度的增加而减少。还提出了改善横向多晶硅PIN二极管电压噪声的方法,并揭示了实验结果。这项工作还证明了几种电子电路可用作利用多晶硅TFT技术的大面积电子系统的扫描,控制和处理电路块。这些电路块利用多晶硅TFT资产,在现有数字,模拟和混合信号电路的基础上进行了改进,同时符合多晶硅TFT作为一种新技术以及柔性基板的局限性。利用SLS多晶硅TFT技术在不锈钢箔基板上演示了包括3位闪存模数转换器,5位R-2R数模转换器,全位移位寄存器,解码器和21种不同加法器单元在内的高性能电路。此外,还讨论了4位哈佛结构微处理器(CPU)以及采用多晶硅TFT技术的高增益运算放大器的设计和开发。这些电路可以与大面积系统集成在同一块单片基板上,以提高系统集成度。最后,这项工作解决了机械应变对柔性TFT器件和多晶硅薄膜晶体管的性能的影响。大多数柔性电子应用需要相当大的柔性和顺应性,这可能导致电子电路上的大量压力。我们已经认识到,随着纵向机械拉伸(压缩)应变的增加,n型TFT的迁移率增加(降低),而p型TFT的迁移率降低(增加)。另一方面,环形振荡器的传播延迟趋于随拉伸而下降,而随压缩应变而呈线性增长。意识到机械应变对性能的影响,柔性多晶硅TFT电子产品有可能有助于找到解决方案来补偿不必要的变化。这项工作的主要目的是进一步提高多晶硅TFT技术并展示其功能,并证明其与多种产品的兼容性。通过在非常规的刚性(石英)和柔性(不锈钢箔)平台上成功开发用于不同应用的多晶硅TFT器件,电路和系统来生产各种基板。

著录项

  • 作者

    Jamshidi-Roudbari, Abbas.;

  • 作者单位

    Lehigh University.;

  • 授予单位 Lehigh University.;
  • 学科 Engineering Electronics and Electrical.
  • 学位 Ph.D.
  • 年度 2010
  • 页码 359 p.
  • 总页数 359
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

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