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High-electron-mobility transistor (HEMT) structure capable of protecting a III-V compound layer and manufacturing method thereof

机译:可保护III-V族化合物层的高电子迁移率晶体管结构及其制造方法

摘要

A semiconductor structure includes a semiconductive substrate having a top surface, a III-V compound layer covering the top surface, and a passivation layer having a lower portion and an upper portion, both comprising at least one of oxide and nitride over the III-V compound layer. The semiconductor structure also includes an etch stop layer between the lower portion and the upper portion of the passivation layer, and a gate stack penetrating through the etch stop layer and landing on the lower portion of the passivation layer. The gate stack is surrounded by the etch stop layer.
机译:半导体结构包括:半导体衬底,该半导体衬底具有顶表面;覆盖该顶表面的III-V族化合物层;以及钝化层,该钝化层具有下部和上部,在III-V之上均包括氧化物和氮化物中的至少一种复合层。半导体结构还包括在钝化层的下部和上部之间的蚀刻停止层,以及穿过蚀刻停止层并着陆在钝化层的下部上的栅叠层。栅极堆叠被蚀刻停止层包围。

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