首页> 外国专利> Waveguides with multiple airgaps arranged in and over a silicon-on-insulator substrate

Waveguides with multiple airgaps arranged in and over a silicon-on-insulator substrate

机译:带有多个气隙的波导布置在绝缘体上硅衬底之中和之上

摘要

Waveguide structures and methods of fabricating waveguide structures. The waveguide structures are formed using a semiconductor substrate that includes a device layer, a handle wafer, a buried oxide layer between the handle wafer and the device layer, and an epitaxial semiconductor layer over the device layer. First and second trench isolation regions extend through the device layer and the epitaxial semiconductor layer. The first and second trench isolation regions are spaced to define a waveguide core region comprising a section of the device layer and a section of the epitaxial semiconductor layer that are arranged between the first and second trench isolation regions. A first airgap and a second airgap are respectively located in the device layer and the buried oxide layer. The first and second airgaps are arranged beneath the waveguide core region, and the first airgap may be arranged between the second airgap and the waveguide core region.
机译:波导结构和制造波导结构的方法。使用半导体衬底来形成波导结构,该半导体衬底包括器件层,处理晶片,在处理晶片与器件层之间的掩埋氧化物层以及在器件层上方的外延半导体层。第一和第二沟槽隔离区延伸穿过器件层和外延半导体层。第一沟槽隔离区域和第二沟槽隔离区域间隔开以限定波导芯区域,该波导核心区域包括布置在第一沟槽隔离区域和第二沟槽隔离区域之间的器件层的一部分和外延半导体层的一部分。第一气隙和第二气隙分别位于器件层和掩埋氧化物层中。第一气隙和第二气隙布置在波导芯区域的下方,并且第一气隙可以布置在第二气隙与波导芯区域之间。

著录项

  • 公开/公告号US10156676B1

    专利类型

  • 公开/公告日2018-12-18

    原文格式PDF

  • 申请/专利权人 GLOBALFOUNDRIES INC.;

    申请/专利号US201815905134

  • 发明设计人 SIVA P. ADUSUMILLI;STEVEN M. SHANK;

    申请日2018-02-26

  • 分类号G02B6/122;G02B6/13;G02B6/136;G02B6/12;H01L31/0232;H01L31/113;

  • 国家 US

  • 入库时间 2022-08-21 12:14:05

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号