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Substrate for printed circuit board, printed circuit board, and method for producing substrate for printed circuit board
Substrate for printed circuit board, printed circuit board, and method for producing substrate for printed circuit board
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机译:印刷电路板用基板,印刷电路板及印刷电路板用基板的制造方法
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摘要
A substrate for a printed circuit board according to the present invention includes a base film having an insulating property and including at least one opening; a first conductive layer that is formed on both surfaces of the base film by applying and heat-treating a conductive ink containing metal particles, and that fills the at least one opening; and a second conductive layer formed, by plating, on at least one of surfaces of the first conductive layer. The metal particles preferably have a mean particle size of 1 nm or more and 500 nm or less.
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