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Nanowire semiconductor device including lateral-etch barrier region

机译:包括横向蚀刻阻挡区的纳米线半导体器件

摘要

A semiconductor device includes a semiconductor-on-insulator wafer having a buried oxide layer. The buried oxide layer includes therein opposing etch barrier regions and a gate region between the etch barrier regions. The semiconductor device further includes at least one nanowire having a channel portion interposed between opposing source/drain portions. The channel portion is suspended in the gate region. A gate electrode is formed in the gate region, and completely surrounds all surfaces of the suspended nanowire. The buried oxide layer comprises a first electrical insulating material, and the etch barrier regions comprising a second electrical insulating material different from the first electrical insulating material.
机译:半导体器件包括具有掩埋氧化物层的绝缘体上半导体晶片。掩埋氧化物层在其中包括相对的蚀刻阻挡区域和在蚀刻阻挡区域之间的栅极区域。该半导体器件还包括至少一个纳米线,该纳米线具有插入在相对的源极/漏极部分之间的沟道部分。沟道部分悬挂在栅极区域中。栅电极形成在栅区域中,并且完全围绕悬浮的纳米线的所有表面。掩埋氧化物层包括第一电绝缘材料,并且蚀刻阻挡区域包括与第一电绝缘材料不同的第二电绝缘材料。

著录项

  • 公开/公告号US10128335B2

    专利类型

  • 公开/公告日2018-11-13

    原文格式PDF

  • 申请/专利权人 INTERNATIONAL BUSINESS MACHINES CORPORATION;

    申请/专利号US201615229593

  • 申请日2016-08-05

  • 分类号H01L29/423;H01L29/06;H01L21/84;H01L21/3115;H01L29/66;H01L29/417;H01L21/311;H01L29/786;H01L21/02;H01L29/78;H01L21/265;H01L21/306;H01L21/308;H01L21/762;B82Y10;H01L29/775;H01L21/3105;H01L29/08;H01L29/161;H01L29/167;

  • 国家 US

  • 入库时间 2022-08-21 12:11:39

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