Light-emitting diode chip with one of a mirror layer and an adhesion-promoting layer for high efficiency and long service life

摘要

A light-emitting diode chip includes a semiconductor layer sequence based on InGaAlAsP and generates visible light or near-infrared radiation, a current spreading layer located directly on the semiconductor layer sequence and based on AlGaAs, an encapsulation layer applied directly to at least one of the current spreading layer and the semiconductor layer sequence and has an average thickness of 10 nm to 200 nm and a defect density of at most 10/mm², at least one cover layer applied directly to the encapsulation layer at least in places, at least one non-metallic reflection layer located in places on a side of the current spreading layer facing away from the semiconductor layer sequence and covered in places by the encapsulation layer, and at least one of a mirror layer and an adhesion-promoting layer arranged in places on a side of the reflection layer facing away from the current spreading layers.