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PATTERNED SI SUBSTRATE-BASED LED EPITAXIAL WAFER AND PREPARATION METHOD THEREFOR

机译:基于图案化的基于SI基质的LED晶圆片及其制备方法

摘要

An patterned Si substrate-based LED epitaxial wafer and a preparation method therefor, the LED epitaxial wafer comprising: a patterned Si substrate (1) and an Al2O3 coating (2) growing on the patterned Si substrate (1); sequentially growing on the Al2O3 coating (2) are a nucleating layer (3), a first buffer layer (4), a first insertion layer (5), a second buffer layer (6), a second insertion layer (7), an n-GaN layer (8), a quantum well layer (9), a p-GaN layer (10), an n-electrode (14) electrically connected to the n-GaN layer and a p-electrode (13) electrically connected to the p-GaN layer. The present invention is suitable for the preparation of large-sized LED epitaxial wafers. Furthermore, the crystal quality is improved, and the light extraction efficiency of the LED die is improved.
机译:基于图案化的Si衬底的LED外延晶片及其制备方法,该LED外延晶片包括:图案化的Si衬底( 1 )和Al 2 O 3 涂层( 2 )在图案化的Si衬底( 1 )上生长;在Al 2 O 3 涂层( 2 )上依次生长的是成核层( 3 ),缓冲层( 4 ),第一插入层( 5 ),第二缓冲层( 6 ),第二插入层( 7 ),n-GaN层( 8 ),量子阱层( 9 ),p-GaN层( 10 < / B>),电连接到n-GaN层的n电极( 14 )和电连接到p-GaN层的p电极( 13 ) 。本发明适用于制备大型LED外延晶片。此外,改善了晶体质量,并且改善了LED管芯的光提取效率。

著录项

  • 公开/公告号US2019148586A1

    专利类型

  • 公开/公告日2019-05-16

    原文格式PDF

  • 申请/专利权人 ENKRIS SEMICONDUCTOR INC;

    申请/专利号US201716090563

  • 发明设计人 LIYANG ZHANG;KAI CHENG;

    申请日2017-03-28

  • 分类号H01L33/12;H01L33/18;H01L33/44;H01L33;

  • 国家 US

  • 入库时间 2022-08-21 12:10:12

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