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BRAZED JOINT AND SEMICONDUCTOR PROCESSING CHAMBER COMPONENT HAVING THE SAME
BRAZED JOINT AND SEMICONDUCTOR PROCESSING CHAMBER COMPONENT HAVING THE SAME
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机译:具有相同功能的钎焊接头和半导体加工腔组件
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摘要
Methods of forming a metallic-ceramic brazed joint are disclosed herein. The method of forming the brazed joint includes deoxidizing the surface of metallic components, assembling the joint, heating the joint to fuse the joint components, and cooling the joint. In certain embodiments, the brazed joint includes a conformal layer. In further embodiments, the brazed joint has features in order to reduce stress concentrations within the joint.
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