APPARATUS FOR LIQUID IMMERSION COOLING, SYSTEM FOR LIQUID IMMERSION COOLING, AND METHOD OF COOLING ELECTRONIC DEVICE

摘要

An apparatus for liquid immersion cooling, the apparatus includes: a casing configured to be partly filled with a first coolant and immerse, in the first coolant, a heat generating component other than a first heat generating component in a plurality of heat generating component; a liquid cooling jacket provided in contact with the first heat generating component placed in the casing, and configured to cool the first heat generating component; a first cooling device configured to dissipate heat of a second coolant sent out from the liquid cooling jacket through a first pipe, thereby cooling the second coolant; and a first pump configured to send out the second coolant cooled by the first cooling device to the liquid cooling jacket through a second pipe.