Substrate cutting apparatus and method of manufacturing display apparatus by using a substrate cutting apparatus

摘要

A substrate cutting apparatus and a method of manufacturing a display apparatus by using the substrate cutting apparatus, so that an occurrence of an error in cutting a substrate may be prevented and the substrate may be exactly cut. The substrate cutting apparatus includes an integrated laser beam oscillator where an infrared wavelength laser beam oscillator and a short pulse laser beam oscillator are adjacent to each other and are fixed; a stage on which a substrate is disposed; and a transfer unit that transfers at least one of the substrate and the integrated laser beam oscillator so as to control a short pulse laser beam to be irradiated on a region of the substrate, on which an infrared wavelength laser beam emitted from the integrated laser beam oscillator has just been irradiated.