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Method for forming an electrical connection between an electronic chip and a carrier substrate and electronic device
Method for forming an electrical connection between an electronic chip and a carrier substrate and electronic device
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机译:在电子芯片和载体衬底之间形成电连接的方法以及电子设备
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摘要
An electrical connection wire connects an electrical connection pad of an electrical chip and an electrical connection pad of a carrier substrate to which the electronic chip is mounted. A dielectric layer surrounds at least the bonding wire. The dielectric layer may be a dielectric sheath or a hardened liquid dielectric material. A dielectric material may also cover at least a portion of the electrical chip and carrier substrate. A liquid electrically conductive material is deposited and hardened to form a local conductive shield surrounding the dielectric layer at the bonding wire.
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