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SUBSTRATE FOR RECEIVING AN OPTOELECTRONIC COMPONENT, OPTOELECTRONIC ASSEMBLY, METHOD FOR PRODUCING A SUBSTRATE AND A METHOD FOR PRODUCING AN OPTOELECTRONIC ASSEMBLY
SUBSTRATE FOR RECEIVING AN OPTOELECTRONIC COMPONENT, OPTOELECTRONIC ASSEMBLY, METHOD FOR PRODUCING A SUBSTRATE AND A METHOD FOR PRODUCING AN OPTOELECTRONIC ASSEMBLY
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机译:用于接收光电子组件的基材,光电子组件,用于生产基材的方法和用于制造光电子组件的方法
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摘要
In various embodiments, a substrate for receiving an optoelectronic component is provided. The substrate includes a carrier body, and filler particles, which are embedded in the carrier body and which each have an electrically and thermally highly conductive core and an electrically insulating enveloping layer.
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