首页> 外国专利> LATERALLY DOUBLE DIFFUSED METAL OXIDE SEMICONDUCTOR (LDMOS) DEVICE ON FULLY DEPLETED SILICON ON INSULATOR (FDSOI) ENABLING HIGH INPUT VOLTAGE

LATERALLY DOUBLE DIFFUSED METAL OXIDE SEMICONDUCTOR (LDMOS) DEVICE ON FULLY DEPLETED SILICON ON INSULATOR (FDSOI) ENABLING HIGH INPUT VOLTAGE

机译:绝缘体(FDSOI)上完全耗尽硅的横向双扩散金属氧化物半导体(LDMOS)器件,可实现高输入电压

摘要

The present disclosure relates to semiconductor structures and, more particularly, to an LDMOS device on FDSOI structures and methods of manufacture. The laterally double diffused semiconductor device includes a gate dielectric composed of a buried insulator material of a semiconductor on insulator (SOI) technology, a channel region composed of semiconductor material of the SOI technology and source/drain regions on a front side of the buried insulator material such that a gate is formed on a back side of the buried insulator material. The gate terminal can also be placed at a hybrid section used as a back-gate voltage to control the channel and the drift region of the device.
机译:本公开涉及半导体结构,更具体地,涉及基于FDSOI结构的LDMOS器件及其制造方法。横向双扩散半导体器件包括由绝缘体上半导体(SOI)技术的掩埋绝缘体材料构成的栅极电介质,由SOI技术的半导体材料构成的沟道区以及在掩埋绝缘体的前侧的源极/漏极区。材料,使得在掩埋的绝缘体材料的背面上形成栅极。栅极端子也可以放置在用作背栅电压的混合部分,以控制器件的沟道和漂移区。

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