HANDLING OF THE THERMAL DISPARITY ACROSS MULTIPLE PACKAGES IN HIGH CAPACITY SSD

摘要

The temperature of the various devices on a printed circuit board (PCB) can change over time as the PCB is used. Additionally, the various devices on the PCB can have different temperatures at the same time. For example, the closer a device is to a heat source, the greater the temperature. Similarly, the further away from the heat source, the lower the temperature. Thus, otherwise identical devices on a PCB can have different temperatures at the same time, and additionally, the temperatures can change over time. By periodically measuring the temperature of the devices, the thermal disparity for the devices can be efficiently and intelligently managed.