首页> 外文会议>Electrical Performance of Electronic Packaging, 2005. IEEE 14th Topical Meeting on >A three-stage preconditioner for geometries with multiple holes and handles in integral equation-based electromagnetic simulation of integrated packages
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A three-stage preconditioner for geometries with multiple holes and handles in integral equation-based electromagnetic simulation of integrated packages

机译:基于积分方程的集成包装电磁仿真中的具有多个孔和手柄的几何形状的三阶段预处理器

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摘要

A novel three-stage approach for preconditioner including loop-tree, basis function rearrangement and incomplete LU is presented. In particular a new technique for construction of loop-tree basis functions for arbitrary-shaped geometries consisting of any number of holes and handles is described. This preconditioner enables fast iterative solution of integral modeling of electromagnetic components in integrated packages.
机译:提出了一种新颖的三阶段预处理器方法,包括循环树,基函数重排和不完全LU。特别地,描述了一种用于构造由任意数量的孔和手柄组成的任意形状的几何结构的循环树基础函数的新技术。该预处理器可以快速迭代地解决集成包装中电磁组件的集成建模问题。

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