首页> 外国专利> Arrays of Cross-Point Memory Structures, and Methods of Forming Arrays of Cross-Point Memory Structures

Arrays of Cross-Point Memory Structures, and Methods of Forming Arrays of Cross-Point Memory Structures

机译:交叉点存储结构的数组以及形成交叉点存储结构的数组的方法

摘要

Some embodiments include a memory array having a first set of lines extending along a first direction, and a second set of lines over the first set of lines and extending along a second direction. Lines of the second set cross lines of the first set at cross-point locations. Memory structures are within the cross-point locations. Each memory structure includes a top electrode material, a bottom electrode material and a programmable material. Rails of insulative material extend parallel to the lines of the second set and alternate with the lines of the second set along the first direction. The programmable material has first regions within the memory structures and second regions over the rails of insulative material. A planarized surface extends across the lines of the second set and across the second regions of the programmable material. Some embodiments include methods of forming memory arrays.
机译:一些实施例包括一种存储器阵列,该存储器阵列具有沿第一方向延伸的第一组线以及在第一组线之上并沿第二方向延伸的第二组线。第二组线在交叉点位置处与第一组线交叉。存储器结构在交叉点位置内。每个存储器结构包括顶部电极材料,底部电极材料和可编程材料。绝缘材料的轨道平行于第二组的线延伸,并沿第一方向与第二组的线交替。可编程材料具有在存储器结构内的第一区域和在绝缘材料的轨道上的第二区域。平坦化的表面跨第二组线和可编程材料的第二区域延伸。一些实施例包括形成存储器阵列的方法。

著录项

  • 公开/公告号US2019080956A1

    专利类型

  • 公开/公告日2019-03-14

    原文格式PDF

  • 申请/专利权人 MICRON TECHNOLOGY INC.;

    申请/专利号US201816179156

  • 发明设计人 SCOTT E. SILLS;

    申请日2018-11-02

  • 分类号H01L21/762;H01L27/11585;G11C8/12;H01L27/10;H01L27/24;H01L21/8239;H01L27/11502;

  • 国家 US

  • 入库时间 2022-08-21 12:07:41

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