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DATA MANAGEMENT AND MINING TO CORRELATE WAFER ALIGNMENT, DESIGN, DEFECT, PROCESS, TOOL, AND METROLOGY DATA
DATA MANAGEMENT AND MINING TO CORRELATE WAFER ALIGNMENT, DESIGN, DEFECT, PROCESS, TOOL, AND METROLOGY DATA
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机译:数据管理和挖掘,以关联晶片对准,设计,缺陷,过程,工具和计量学数据
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摘要
Implementations described herein generally relate to improving silicon wafer manufacturing. In one implementation, a method includes receiving information describing a defect. The method further includes identifying a critical area of a silicon wafer and determining the probability of the defect occurring in the critical area. The method further includes determining, based on the probability, the likelihood of an open or a short occurring as a result of the defect occurring in the critical area. The method further includes providing, based on the likelihood, predictive information to a manufacturing system. In some embodiments, corrective action may be taken based on the predictive information in order to improve silicon wafer manufacturing.
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