CHARACTERIZATION OF ULTRASONIC CONSOLIDATION BOND QUALITY

摘要

Methods, systems, and non-transitory computer-readable storage media having programs are described for monitoring an ultrasonic bonding operation via acoustic and/or vibration measurements and analyzing the measurements in order to predict and/or characterize the quality of a weld resulting from the bonding operation. The measurements are non-destructively acquired and the characterization is expressed as a bond quality index value.