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Vertical nanoribbon array (VERNA) thermal interface materials with enhanced thermal transport properties
Vertical nanoribbon array (VERNA) thermal interface materials with enhanced thermal transport properties
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机译:具有增强的热传输特性的垂直纳米带阵列(VERNA)热界面材料
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摘要
A thermal interface material (TIM) and method for manufacture is disclosed. A vertically aligned carbon nanotube (VACNT) array is formed on a substrate, then individual CNTs are cleaved to form a vertical nanoribbon array (VERNA). An array of aligned, upright, flat, highly-compliant ribbon elements permit a higher packing density, better ribbon-to-ribbon engagement factor, better contact with adjoining surfaces and potentially achievement of theoretical thermal conductance limit (˜1 GW/m2K) for such nanostructured polycyclic carbon materials. Methods for forming the VERNA include either or both of electrochemical and gas phase processing steps.
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