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Enhancement of the thermal properties of a vertically aligned carbon nanotube thermal interface material using a tailored polymer

机译:使用量身定制的聚合物增强垂直排列的碳纳米管热界面材料的热性能

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This paper presents our results on thermal properties measurements of thermal interface materials based on vertically aligned carbon nanotubes. In this system, the total interface resistance is the sum of thermal resistances created by the contact between the growth surface and the CNTs, the intrinsic resistance of the CNTs array, and the contact between the loose end of the CNTs and the opposite substrate. The latter is reported to be the limiting factor in the optimization of the global interface resistance, and in this work, polymers are used to enhance the thermal contact. Two polymers are studied. It is shown that the use of a polymer as interface material, despite its low thermal conductivity, leads to an improvement of the total thermal resistance. Experimental data and equilibrium molecular dynamics (EMD) show that the thermal contact resistance when using a reactive polymer — able to establish covalent bonds with the CNTs — is at least three times lower than that with the Van der Waals interaction polymer. The reactive polymer also enhances adhesion between CNTs and the polymer, which allows the mechanical complete transfer of the aligned CNTs array from growth substrate to a copper substrate. This transfer process allows to expand applications for VACNTs.
机译:本文介绍了基于垂直排列的碳纳米管的热界面材料的热性能测量结果。在该系统中,总界面电阻是由生长表面与CNT之间的接触,CNT阵列的固有电阻以及CNT的松散端与相对的基板之间的接触所产生的热阻之和。据报道后者是优化整体界面电阻的限制因素,在这项工作中,聚合物被用于增强热接触。研究了两种聚合物。结果表明,尽管聚合物的导热系数低,但使用其作为界面材料仍可改善总热阻。实验数据和平衡分子动力学(EMD)表明,使用反应性聚合物(能够与CNT建立共价键)时的热接触电阻至少比与范德华相互作用聚合物的热接触电阻低三倍。反应性聚合物还增强了CNT与聚合物之间的附着力,这允许将对齐的CNT阵列从生长基质到铜基质进行机械完全转移。此转移过程允许扩展VACNT的应用程序。

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