首页> 外国专利> High voltage laterally diffused MOSFET with buried field shield and method to fabricate same

High voltage laterally diffused MOSFET with buried field shield and method to fabricate same

机译:具有掩埋场屏蔽的高压横向扩散MOSFET及其制造方法

摘要

A structure includes a laterally diffused (LD) MOSFET with an n-type drift region disposed on a surface of a substrate and a p-type body region contained in the drift region. The structure further includes an n-type source region contained in the p-type body region; an n-type drain region contained in the n-type drift region; a gate electrode disposed on a gate dielectric overlying a portion of the p-type body region and the n-type drift region and an electrically conductive field shield member disposed within the n-type drift region at least partially beneath the p-type body region and generally parallel to the gate electrode. The electrically conductive buried field shield member is contained within and surrounded by a layer of buried field shield oxide and is common to both a first LD MOSFET and a second LD MOSFET that are connected in parallel. Methods to fabricate the structure are also disclosed.
机译:一种结构包括横向扩散(LD)MOSFET,其具有布置在基板表面上的n型漂移区和包含在该漂移区中的p型体区。该结构还包括包含在p型体区中的n型源区; n型漂移区中包含的n型漏区;设置在栅电介质上的栅极电极,其覆盖部分p型体区和n型漂移区,以及至少部分位于p型体区下方的位于n型漂移区内的导电场屏蔽部件并且通常平行于栅电极。导电的掩埋场屏蔽构件包含在掩埋场屏蔽氧化物层中并被其包围,并且对于并联连接的第一LD MOSFET和第二LD MOSFET都是共用的。还公开了制造该结构的方法。

著录项

  • 公开/公告号US10170568B2

    专利类型

  • 公开/公告日2019-01-01

    原文格式PDF

  • 申请/专利权人 INTERNATIONAL BUSINESS MACHINES CORPORATION;

    申请/专利号US201715792948

  • 发明设计人 TAK H. NING;

    申请日2017-10-25

  • 分类号H01L29/78;H01L29/66;H01L21/336;G06F17/50;H01L27/088;H01L29/739;H01L29/40;H01L29/10;H01L21/265;

  • 国家 US

  • 入库时间 2022-08-21 12:04:56

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