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Si-BASED SPINTRONICS DEVICES

机译:硅基电子器件

摘要

Multi-layer n- and p-type Si thin film structures are presented which are configured with through-thickness strain gradients in order to take advantage of flexoelectric polarization and achieve Rashba SOC at Si interfaces. In freestanding thin films, through-thickness strain gradients can be achieved due to differential thermal expansion. In on-substrate thin films, through-thickness strain gradients can be achieved by use of a thick insulating layer. The residual stress due to the insulating layer will give rise to through-thickness strain gradients as shown in FIG. 1B. The residual stresses can be controlled using layer thickness, deposition parameters and layer material. Examples systems include MgO/(p-Si), Pd/Ni81Fe19/MgO/p-Si, Pd/Ni80Fe20/MgO/n-Si, Pd/Ni80Fe20/MgO/p-Si, and Ni80Fe20/p-Si.
机译:提出了多层n型和p型Si薄膜结构,这些结构具有贯穿厚度的应变梯度,以便利用柔电极化并在Si界面处实现Rashba SOC。在独立式薄膜中,由于差异的热膨胀,可以实现贯穿厚度的应变梯度。在衬底上的薄膜中,可以通过使用厚的绝缘层来实现贯穿厚度的应变梯度。如图2所示,由绝缘层引起的残余应力将产生贯穿厚度的应变梯度。 1 B。可以使用层厚度,沉积参数和层材料来控制残余应力。示例系统包括MgO /(p-Si),Pd / Ni 81 Fe 19 / MgO / p-Si,Pd / Ni 80 Fe 20 / MgO / n-Si,Pd / Ni 80 Fe 20 / MgO / p-Si和Ni 80 Fe 20 / p-Si。

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