Potted Electronic Module with Improved Adhesion of Potting Compound

摘要

A potted electronic module includes an electronic assembly with a conductor such as a shunt that is arranged in a housing, and includes an electrical contact guided out through the housing wall, and a potting compound within the housing. The module may be produced by removing a protective layer from an area of the conductor by ablation, and then introducing a potting or casting compound into the housing, so that the potting compound covers a location at which the electrical contact passes through the housing wall, and the potting compound adheres directly onto the exposed conductor at the area at which the protective layer was removed.