THERMAL SELF-LEARNING WITH REINFORCEMENT LEARNING AGENT

摘要

An embodiment of a semiconductor package apparatus may include technology to learn thermal behavior information of a system based on input information including one or more of processor information, thermal information, and cooling information, and provide information to adjust one or more of a parameter of a processor and a parameter of a cooling subsystem based on the learned thermal behavior information and the input information. Other embodiments are disclosed and claimed.