Soft active solder for ultrasound soldering of non-metal and metal materials or of two non-metal materials

摘要

Soft active solder for ultrasound soldering of non-metallic and metallic or two non-metallic materials at higher application temperatures comprises: a) at least double components alloy Sn-Sb containing 5 % to 10 % by weight of Sb and b) 0,5 % to 4 % by weight of Ti and/or 0,1 % to 2 % by weight of La. The double component alloy Sn-Sb containing 5 % to 10 % of Sn may be added with a third component, 1 % to 30 % by weight of Ag.