首页> 外国专利> COMPLEMENTARY METAL OXIDE SEMICONDUCTOR (MOS) (CMOS) STANDARD CELL CIRCUITS EMPLOYING METAL LINES IN A FIRST METAL LAYER USED FOR ROUTING, AND RELATED METHODS

COMPLEMENTARY METAL OXIDE SEMICONDUCTOR (MOS) (CMOS) STANDARD CELL CIRCUITS EMPLOYING METAL LINES IN A FIRST METAL LAYER USED FOR ROUTING, AND RELATED METHODS

机译:在用于布线的第一金属层中采用金属线的互补金属氧化物半导体(MOS)(CMOS)标准单元电路及相关方法

摘要

Title: COMPLEMENTARY METAL OXIDE SEMICONDUCTOR (MOS) (CMOS) STANDARD CELL CIRCUITS EM- PLOYING METAL LINES IN A FIRST METAL LAYER USED FOR ROUTING, AND RELATED METHODS (57) : Complementary metal oxide semiconductor (MOS) (CMOS) standard cell circuits employing metal lines in a first metal layer used for routing, and related methods are disclosed. In one aspect, a CMOS standard cell circuit includes first supply rail, second supply rail, and metal lines disposed in the first metal layer. One or more of the metal lines are dynamically cut corresponding to a first cell boundary and a second cell boundary of the CMOS standard cell such that the metal lines have cut edges corresponding to the first and second cell boundaries. Metal lines not cut corresponding to the first and second cell boundaries can be used to interconnect nodes of the CMOS standard cell circuit. Dynamically cutting the metal lines allows the first metal layer to be used for routing, reducing routing in other metal layers such that fewer vias and metal lines are disposed above the first metal layer. LAYOUT (300) STANDARD CELL (302) 306 UC_V(2) 318(2X1) 4(1) C(8) 4(2) T(3) C(3 318(1)(1) - T(4).( UC(1) FIG. 3 W O 20 18/ 19 10 47 A2 (12) INTERNATIONAL APPLICATION PUBLISHED UNDER THE PATENT COOPERATION TREATY (PCT) (19) World Intellectual Property Organization International Bureau (43) International Publication Date 18 October 2018 (18.10.2018) WIPO I PCT o mono IIl °nolo Oil IIIII DID IIIII Ho Imo X11 ois (10) International Publication Number WO 2018/191047 A2 (51) International Patent Classification: HOlL 27/118 (2006.01) G06F 17/50 (2006.01) HOlL 27/02 (2006.01) (21) International Application Number: PCT/US2018/025648 (22) International Filing Date: 02 April 2018 (02.04.2018) (25) Filing Language: English (26) Publication Language: English (30) Priority Data: 15/487,222 13 April 2017 (13.04.2017) US (71) Applicant: QUALCOMM INCORPORATED [US/US]; ATTN: International IP Administration, 5775 Morehouse Drive, San Diego, California 92121-1714 (US). (72) Inventors: CORREALE, JR., Anthony; 5775 Morehouse Drive, San Diego, California 92121 (US). GOODALL, III, William; 5775 Morehouse Drive, San Diego, California 92121 (US). ILES, Philip, Michael; 5775 Morehouse Dri- ve, San Diego, California 92121 (US). (74) Agent: DAVENPORT, Taylor, M.; WITHROW & TER- RANOVA, PLLC, 106 Pinedale Springs Way, Cary, North Carolina 27511 (US). (81) Designated States (unless otherwise indicated, for every kind of national protection available): AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW. (84) Designated States (unless otherwise indicated, for every kind of regional protection available): ARIPO (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW), Eurasian (AM, AZ, BY, KG, KZ, RU, TJ, TM), European (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR), OAPI (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG). [Continued on next page] WO 2018/191047 A2 MIDIOHOMBIRDERIOMOIHMOIONHOHEHOIMIE Declarations under Rule 4.17: as to applicant's entitlement to apply for and be granted a patent (Rule 4.17(H)) as to the applicant's entitlement to claim the priority of the earlier application (Rule 4.17(iii)) Published: without international search report and to be republished upon receipt of that report (Rule 48.2(g))
机译:标题:在用于布线的第一金属层中沉积金属线的互补金属氧化物半导体(MOS)(CMOS)标准单元电路以及相关方法(57):互补金属氧化物半导体(MOS)(CMOS)标准单元电路,采用公开了用于布线的第一金属层中的金属线以及相关方法。在一个方面,CMOS标准单元电路包括第一供电轨,第二供电轨和设置在第一金属层中的金属线。对应于CMOS标准单元的第一单元边界和第二单元边界动态地切割一条或多条金属线,使得金属线具有对应于第一单元边界和第二单元边界的切割边缘。未被切割为与第一单元边界和第二单元边界相对应的金属线可以用于互连CMOS标准单元电路的节点。动态切割金属线允许将第一金属层用于布线,从而减少其他金属层中的布线,使得在第一金属层上方布置的通孔和金属线更少。布局(300)标准电池(302)306 UC_V(2)318(2X1)4(1)C(8)4(2)T(3)

著录项

  • 公开/公告号SG11201908898QA

    专利类型

  • 公开/公告日2019-10-30

    原文格式PDF

  • 申请/专利权人 QUALCOMM INCORPORATED;

    申请/专利号SG11201908898Q

  • 发明设计人 CORREALE JR.;GOODALL III;ILES PHILIP;

    申请日2018-04-02

  • 分类号H01L27/118;G06F17/50;H01L21/8238;H01L27/02;H01L27/092;

  • 国家 SG

  • 入库时间 2022-08-21 11:59:56

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