首页> 外国专利> COMPLEMENTARY METAL OXIDE SEMICONDUCTOR (MOS) (CMOS) STANDARD CELL CIRCUITS EMPLOYING METAL LINES IN A FIRST METAL LAYER USED FOR ROUTING, AND RELATED METHODS

COMPLEMENTARY METAL OXIDE SEMICONDUCTOR (MOS) (CMOS) STANDARD CELL CIRCUITS EMPLOYING METAL LINES IN A FIRST METAL LAYER USED FOR ROUTING, AND RELATED METHODS

机译:在用于布线的第一金属层中采用金属线的互补金属氧化物半导体(MOS)(CMOS)标准单元电路及相关方法

摘要

Complementary metal oxide semiconductor (MOS) (CMOS) standard cell circuits employing metal lines in a first metal layer used for routing, and related methods are disclosed. In one aspect, a CMOS standard cell circuit includes first supply rail, second supply rail, and metal lines disposed in the first metal layer. One or more of the metal lines are dynamically cut corresponding to a first cell boundary and a second cell boundary of the CMOS standard cell such that the metal lines have cut edges corresponding to the first and second cell boundaries. Metal lines not cut corresponding to the first and second cell boundaries can be used to interconnect nodes of the CMOS standard cell circuit. Dynamically cutting the metal lines allows the first metal layer to be used for routing, reducing routing in other metal layers such that fewer vias and metal lines are disposed above the first metal layer.
机译:公开了在用于布线的第一金属层中采用金属线的互补金属氧化物半导体(MOS)(CMOS)标准单元电路,以及相关方法。在一个方面,一种CMOS标准单元电路包括第一供电轨,第二供电轨和设置在第一金属层中的金属线。对应于CMOS标准单元的第一单元边界和第二单元边界动态地切割一条或多条金属线,使得金属线具有对应于第一单元边界和第二单元边界的切割边缘。未被切割为与第一单元边界和第二单元边界相对应的金属线可以用于互连CMOS标准单元电路的节点。动态切割金属线允许将第一金属层用于布线,从而减少其他金属层中的布线,使得在第一金属层上方布置的通孔和金属线更少。

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