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METHOD OF MAKING A SEMICONDUCTOR DEVICE WITH A BURIED INSULATING LAYER FORMED BY ANNEALING A SUPERLATTICE

机译:用半绝缘层退火制成的绝缘层制造半导体器件的方法

摘要

A method for making a semiconductor device may include forming a superlattice on a semiconductor substrate including a respective plurality of stacked groups of layers. Each group of layers may include a plurality of stacked base semiconductor monolayers defining a base semiconductor portion, and at least one non-semiconductor monolayer constrained within a crystal lattice of adjacent base semiconductor portions. Further, at least some semiconductor atoms from opposing base semiconductor portions may be chemically bound together through the at least one non-semiconductor monolayer therebetween. The method may further include epitaxially forming a semiconductor layer on the superlattice, and annealing the superlattice to form a buried insulating layer in which the at least some semiconductor atoms are no longer chemically bound together through the at least one non-semiconductor monolayer therebetween.
机译:制造半导体器件的方法可以包括在包括各自的多个堆叠的层组的半导体衬底上形成超晶格。每一层组可包括限定基础半导体部分的多个堆叠的基础半导体单层,以及约束在相邻基础半导体部分的晶格内的至少一个非半导体单层。此外,来自相对的基础半导体部分的至少一些半导体原子可以通过其间的至少一个非半导体单层化学结合在一起。该方法可以进一步包括在超晶格上外延形成半导体层,并对超晶格进行退火以形成掩埋绝缘层,其中至少一些半导体原子不再通过其间的至少一个非半导体单层化学键合在一起。

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