首页> 外国专利> WATERPROOF LIGHTING MODULE WHICH CHIP-ON-BOARD (COB), DIE-ON-BOARD (DOB) OR SIMILAR LED CLUSTERS INTEGRATED WITH OPTICAL STRUCTURE

WATERPROOF LIGHTING MODULE WHICH CHIP-ON-BOARD (COB), DIE-ON-BOARD (DOB) OR SIMILAR LED CLUSTERS INTEGRATED WITH OPTICAL STRUCTURE

机译:集成有光学结构的板上芯片(COB),板上芯片(DOB)或类似LED的防水照明模块

摘要

The invention relates to an integrated lighting module (1) that is watertight, heat conduction enhanced and easily removable which is manufactured by assembly of cover, which carries an optical structure(lens) and a connection apparatus, via screws or bolts to a chassis for transferring electrical signals and/or a printed circuit board (PCB), which COB, DOB and / or similar LED clusters used in lighting systems are installed.
机译:本发明涉及一种不透水,增强了热传导并且易于拆卸的集成照明模块(1),该集成照明模块(1)是通过组装带有光学结构(透镜)的盖和通过螺钉或螺栓连接到用于底盘的连接装置而制造的。传输电信号和/或印刷电路板(PCB),并安装照明系统中使用的COB,DOB和/或类似的LED集群。

著录项

  • 公开/公告号WO2019045658A2

    专利类型

  • 公开/公告日2019-03-07

    原文格式PDF

  • 申请/专利号WO2017TR50488

  • 发明设计人 GUR ENGIN;

    申请日2017-10-10

  • 分类号F21V15/01;F21V19;F21V31;F21V23;H05K1/18;F21V23/06;F21V21;F21Y115/10;H05K1/14;

  • 国家 WO

  • 入库时间 2022-08-21 11:56:04

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