首页> 外国专利> 3D PIXEL CIRCUIT FOR MICRODISPLAY WITH REDUCED PIXEL SIZE AND METHOD OF FORMING SAME

3D PIXEL CIRCUIT FOR MICRODISPLAY WITH REDUCED PIXEL SIZE AND METHOD OF FORMING SAME

机译:具有减小的像素尺寸的微显示器的3D像素电路及其形成方法

摘要

A vertically stacked pixel circuit is provided that includes a high voltage device for driving a pixel on an upper silicon layer, and low voltage circuitry (such as matrix addressing circuitry, data storage circuitry and uniformity compensation circuitry) on a lower silicon layer. The circuitry on the upper and lower silicon layers are electrically connected via a through-silicon via. This unique arrangement allows the high voltage device for driving a pixel to be physically located on top of the larger number of low voltage devices in the lower silicon layer in order to achieve a substantial reduction in overall pixel emission area. The vertically stacked pixel circuit is particularly suited for organic light-emitting diode microdisplays.
机译:提供了一种垂直堆叠的像素电路,该电路包括用于驱动上硅层上的像素的高压器件以及在下硅层上的低压电路(例如矩阵寻址电路,数据存储电路和均匀性补偿电路)。上硅层和下硅层上的电路通过硅通孔电连接。这种独特的布置允许将用于驱动像素的高压器件物理地放置在下部硅层中的大量低压器件的顶部,从而实现总体像素发射面积的显着减小。垂直堆叠的像素电路特别适合有机发光二极管微型显示器。

著录项

  • 公开/公告号WO2019164867A1

    专利类型

  • 公开/公告日2019-08-29

    原文格式PDF

  • 申请/专利权人 EMAGIN CORPORATION;

    申请/专利号WO2019US18671

  • 发明设计人 WACYK IHOR;

    申请日2019-02-20

  • 分类号H01L21/822;H01L27/06;H01L27/088;H01L27/32;

  • 国家 WO

  • 入库时间 2022-08-21 11:53:24

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