METHOD FOR SOLDERING SURFACE-MOUNT COMPONENT AND SURFACE-MOUNT COMPONENT

摘要

The solder material for die bonding is prevented from dissolving even when the surface mounted component formed by using the solder material for die bonding is soldered to the printed circuit board using the solder material for mounting. A surface-mounted component formed by using a (Sn-Sb) high melting point solder material containing Sn as a main component having a Cu content of a predetermined value or less as a solder material 30 for a die pad, (Sn-Ag-Cu-Bi) based solder material as the solder material 70 for soldering. Since the solidus temperature of the solder material 30 for die bonding is 243 占 폚 and the liquidus temperature of the soldering material 70 for mounting is about 215 to 220 占 폚, The solder material 30 for bonding is not dissolved.