ULTRATHIN COPPER FOIL WITH CARRIER AND METHOD FOR MANUFACTURING SAME COPPER-CLAD LAMINATE AND METHOD FOR MANUFACTURING PRINTED-WIRING BOARD

摘要

An object of the present invention is to provide an extremely thin copper foil with a carrier capable of both forming a microcircuit and laser workability in the process of producing a copper clad laminate or a printed wiring board. The ultra-thin copper foil with a carrier according to the present invention comprises a carrier foil, a release layer and an ultra-thin copper foil in this order. The surface of the ultra-thin copper foil on the release layer side has an average distance (Peak spacing) between surface peaks of 20 占 퐉 or less and a maximum elevation difference (Wmax) of bending of 1.0 占 퐉 or less, The maximum height difference (Wmax) of the bending is 1.0 탆 or less.