AQUEOUS POLISHING COMPOSITION AND PROCESS FOR CHEMICALLY MECHANICALLY POLISHING SUBSTRATES CONTAINING SILICON OXIDE DIELECTRIC AND POLYSILICON FILMS

摘要

The present invention is directed to an aqueous polishing composition comprising: (A) abrasive cerium oxide particles; And (B) an amphipathic nonionic surfactant selected from water-soluble and water-dispersible, linear and branched polyoxyalkylene block copolymers of formula (I) _{R [(B1) m / (} B2) n Y] p (I), Wherein the exponents and variables have the following meanings: m, n and p are integers of 1 or more; R is a monovalent or polyvalent organic residue other than a C ₅ -C ₂₀ alkyl group or a hydrogen atom; (B1) is a block of oxyethylene monomer units; (B2) is a substituted oxyalkylene group in which the substituent is selected from two methyl groups, alkyl groups with more than two carbon atoms and cycloalkyl, aryl, alkyl-cycloalkyl, alkyl-aryl, cycloalkyl-aryl and alkyl- A block of monomeric units; Y is a monovalent organic residue other than a C ₅ -C ₂₀ alkyl group or a hydrogen atom; However, when (B) contains more than one block (B1) or (B2), two blocks of the same type are separated by different types of blocks.