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- Low-stress vias

机译:-强调爱的暴力

摘要

A component (10) comprising a substrate (20) having a front surface (22) and a rear surface (21) spaced from the front surface, an opening (30) extending from the rear surface toward the front surface, And may include an elongated conductive via 40. The substrate 20 may have a CTE of less than 10 ppm /C. The openings 30 may define an inner surface 31 between the front surface 22 and the rear surface 21. Conductive via 40 may include a first metal layer 41 overlying inner surface 31 and a second metal region 42 overlying and electrically coupled to the first metal layer. The second metal region 42 may have a CTE that exceeds the CTE of the first metal layer 41. The conductive vias 40 may have an effective CTE that is less than 80% of the CTE of the second metal region 42 over the diameter D of the conductive vias.
机译:部件(10)包括:基板(20),其具有前表面(22)和与前表面间隔开的后表面(21);开口(30),其从后表面朝着前表面延伸,并且可以包括:延长的导电通孔40。衬底20的CTE可以小于10ppm /℃。开口30可以在前表面22和后表面21之间限定内表面31。导电通孔40可以包括覆盖内表面31的第一金属层41和覆盖并电耦合到第一金属层的第二金属区域42。第二金属区域42可具有超过第一金属层41的CTE的CTE。导电通孔40可具有在第二金属区域42的直径D上小于第二金属区域42的CTE的80%的有效CTE。导电通孔。

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