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BRITTLE FILM SUBSTRATE HAVING INDUCED CRACK AND METHOD FOR FORMING INDUCED CRACK ON BRITTLE FILM SUBSTRATE

机译:具有诱发裂纹的脆性薄膜基质以及在脆性薄膜基质上形成诱发裂纹的方法

摘要

The present invention relates to a brittle film substrate having an induced crack and a method for forming an induced crack on a brittle film substrate. The brittle film having the induced crack comprises: a brittle film having a crack due to outer impact; a substrate installed under the brittle film and supporting the brittle film; and a middle layer installed between the brittle film and the substrate. A material with lower hardness than that of the substrate is used for the middle layer. The crack generated on the brittle film is induced in the upper part in which the middle layer is arranged. The method for forming an induced crack on a brittle film substrate comprises: a substrate preparing step of preparing the substrate; a middle layer arranging step of arranging the middle layer on the substrate; a brittle film forming step of forming the brittle film on the upper part of the middle layer; and a crack inducing step of inducing the crack by increasing stress in the brittle film.;COPYRIGHT KIPO 2019
机译:本发明涉及具有诱发裂纹的脆性膜基板以及在该脆性膜基板上形成诱发裂纹的方法。具有诱发裂纹的脆性膜包括:由于外部冲击而具有裂纹的脆性膜。基板,其安装在脆性膜下方并支撑脆性膜;中间层安装在脆性薄膜和基板之间。中间层使用硬度比基材低的材料。在布置有中间层的上部中引起在脆性膜上产生的裂纹。在脆膜基材上形成诱发裂纹的方法包括:制备基材的基材制备步骤;和中间层布置步骤,在基板上布置中间层;脆膜形成步骤,在中间层的上部形成脆膜。以及通过增加脆性薄膜中的应力来诱导裂纹的裂纹诱导步骤。; COPYRIGHT KIPO 2019

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