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BRITTLE FILM SUBSTRATE HAVING INDUCED CRACK AND METHOD FOR FORMING INDUCED CRACK ON BRITTLE FILM SUBSTRATE
BRITTLE FILM SUBSTRATE HAVING INDUCED CRACK AND METHOD FOR FORMING INDUCED CRACK ON BRITTLE FILM SUBSTRATE
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机译:具有诱发裂纹的脆性薄膜基质以及在脆性薄膜基质上形成诱发裂纹的方法
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摘要
The present invention relates to a brittle film substrate having an induced crack and a method for forming an induced crack on a brittle film substrate. The brittle film having the induced crack comprises: a brittle film having a crack due to outer impact; a substrate installed under the brittle film and supporting the brittle film; and a middle layer installed between the brittle film and the substrate. A material with lower hardness than that of the substrate is used for the middle layer. The crack generated on the brittle film is induced in the upper part in which the middle layer is arranged. The method for forming an induced crack on a brittle film substrate comprises: a substrate preparing step of preparing the substrate; a middle layer arranging step of arranging the middle layer on the substrate; a brittle film forming step of forming the brittle film on the upper part of the middle layer; and a crack inducing step of inducing the crack by increasing stress in the brittle film.;COPYRIGHT KIPO 2019
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