MAUNFACTURING METHOD OF PADS IN SEMICONDUCTOR CHIP MOVER AND RAW PADS SETS FOR MANUFACTURING THE PADS

摘要

According to an aspect of the present invention, a manufacturing method of an absorbing member of a semiconductor chip transfer device, having an absorbing unit for absorbing a semiconductor chip, includes: a step of preparing various types of base members each having different shapes; and a step of forming the absorbing unit on the base member of a type corresponding to the semiconductor chip to be transferred among various types of the base members to post-process the same.