INFO EMI EMI SHIELDING STRUCTURE IN INFO PACKAGE

摘要

A method comprises the steps of: forming a metal post over a first dielectric layer; attaching a second dielectric layer over the first dielectric layer; encapsulating a device die, the second dielectric layer, a shielding structure, and the metal post in an encapsulating material; flattening the encapsulating material to reveal the device die, the shielding structure, and the metal post; and forming an antenna electrically coupled to the device die. The antenna has a part vertically aligned to a part of the device die.