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Pretreatment of Thick-Film Aluminum Electrode for Metal Plating

机译:用于金属电镀的厚膜铝电极的预处理

摘要

Provided is a method for pretreatment of a thick-film aluminum electrode. The pretreatment is processed before subsequent metal plating. The thick-film aluminum electrode is pretreated with purely mechanical or chemical treatment or a mixture of mechanical and chemical treatment. The chemical treatment is alkaline/acid cleaning or chemical anodization, and a surface of the thick-film aluminum electrode is even and becomes alumina. Moreover, a nonconductive material on the surface is removed. The thick-film aluminum electrode has a surface that is flat and has low oxygen content. The thick-film aluminum electrode has quality similar to a thick-film electrode of precious metal silver for subsequent metal plating.
机译:提供了一种用于厚膜铝电极的预处理的方法。预处理在随后的金属镀层之前进行。厚膜铝电极经过纯机械或化学处理或机械和化学处理的混合物进行了预处理。化学处理是碱/酸清洗或化学阳极氧化,并且厚膜铝电极的表面平坦并且变成氧化铝。此外,去除了表面上的非导电材料。厚膜铝电极的表面平坦且氧含量低。厚膜铝电极的质量类似于用于后续金属电镀的贵金属银厚膜电极。

著录项

  • 公开/公告号KR20190075528A

    专利类型

  • 公开/公告日2019-07-01

    原文格式PDF

  • 申请/专利权人 NATIONAL CHENG KUNG UNIVERSITY;

    申请/专利号KR20170177179

  • 发明设计人 WEN HSI LEE;

    申请日2017-12-21

  • 分类号C25D5/44;B24B31/02;C23G1/12;C23G1/22;C25D11/18;C25D17/10;C25D5/04;

  • 国家 KR

  • 入库时间 2022-08-21 11:50:32

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