THICK-FILM ALUMINUM ELECTRODE PASTE COMPOSITION AND CHIP RESISTOR FABRICATED BY PRETREATMENT OF METAL PLATING THEREOF

摘要

To provide a thick-film aluminum electrode paste, and a chip resistor fabricated by pretreatment of metal plating thereof.SOLUTION: VO-ZnO-BOor BaO-ZnO-BOglass is added at a proportion of 3-30 wt.% with respect to the total amount of a thick-film aluminum electrode paste to a metal aluminum ball with a content of 50-70 wt.% and an organic additive with a content of 10-20 wt.%, and stirred; an obtained mixture is filtered to prepare a conductive aluminum paste; the thick-film aluminum electrode paste is applied on an alumina ceramic substrate; and the pasted substrate is dried and sintered to form a thick-film aluminum electrode. For the thick-film aluminum electrode, before metal plating in the following process, surface irregularities and nonconductive alumina of the thick-film aluminum electrode, which are an anti-surface coating, are removed, and the thick-film aluminum electrode is allowed to have surface roughness and low oxygen content so that the characteristics of a chip resistor using the thick-film aluminum electrode are equivalent to those using thick-film printed silver electrodes and those using thick-film printed copper electrodes sintered in a reducing atmosphere.SELECTED DRAWING: None