TEM METHOD FOR SAMPLE ORIENTATION FOR TEM LAMELLA PREPARATION

摘要

The present invention relates to a method for sample orientation for a TEM lamella preparation. The present invention is able to align substrates for milling an ion beam or for another inspection or processing by acquiring an electronic channeling pattern (ECP) or another electronic beam scattering pattern from the substrates based on an electronic beam backward scattering from a substrate. The ECP is a function of a substrate crystal orientation, being used for inclined angles related to ECP values at the maximum point, the minimum point, or a middle point or a nearby part to determine a substrate inclination. Next, such inclination is compensated or removed by using an inclination stage engaged with the substrate or by controlling an ion beam axis. In common embodiments, circuit substrate ′chunks′ are aligned for milling the ion beam, and display circuit features for evaluating circuit processing.