EPOXY RESIN VARNISH COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR ELEMENT AND FILM FOR ENCAPSULATING SEMICONDUCTOR ELEMENT PRODUCED USING SAME

摘要

The present invention relates to a varnish composition for encapsulating a semiconductor element, which comprises: an epoxy resin; a curing agent; an inorganic filler; and a solvent and satisfies formula 1, 6 = TI = viscosity at 0.6 rpm/viscosity at 6.0 rpm = 9, to a film for encapsulating a semiconductor element produced using the same, and to a semiconductor device encapsulated using the same. The film for encapsulating a semiconductor element exhibits excellent performance when applied for encapsulating a semiconductor element due to excellent dispersibility of the inorganic filler.;COPYRIGHT KIPO 2019