NEGATIVE DEVELOPING METHOD AND NEGATIVE DEVELOPING APPARATUS

摘要

After completion of the development process, the substrate is rotated at a high speed without supplying a cleaning liquid to the surface of the substrate, and a large centrifugal force is applied to the developer on the resist film to quickly remove the developer from the surface of the substrate. As a result, the developing process can be stopped at the timing as assumed, and a circuit pattern according to the dimensions can be formed. At this time, since the dissolved products are also removed from the substrate together with the developer, occurrence of development defects due to the dissolved products can be prevented. Therefore, it is possible to suitably maintain the quality of the negative developing treatment while reducing the amount of the cleaning liquid used.