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METHOD AND DEVICE FOR CUTTING OUT HARD-BRITTLE SUBSTRATE
METHOD AND DEVICE FOR CUTTING OUT HARD-BRITTLE SUBSTRATE
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机译:剪切硬脆基质的方法和装置
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摘要
A plurality of substrates 2 are allocated on the plate 1 made of a hard-brittle material at intervals necessary for cutting by blast so that the first protective film 4 And the second protective film 5 is formed on the front and back sides of the margin 3 of the plate material 1. [ The second protective film is provided at an interval necessary for cutting by blasting with respect to the first protective film 4 and at the same time the outer circumference of the second protective film 5 is placed at a position of 5 mm or less from the periphery of the plate 1 And a cutting area 6 is formed between the first protective film 4 and the first protective film 4 and the second protective film 5 so that this part is blasted to one side of the plate 1 After cutting the surface to a depth of about one half, the cutting is performed until the sheet 1 passes through the other surface.
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