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METHOD AND DEVICE FOR CUTTING OUT HARD-BRITTLE SUBSTRATE

机译:剪切硬脆基质的方法和装置

摘要

A plurality of substrates 2 are allocated on the plate 1 made of a hard-brittle material at intervals necessary for cutting by blast so that the first protective film 4 And the second protective film 5 is formed on the front and back sides of the margin 3 of the plate material 1. [ The second protective film is provided at an interval necessary for cutting by blasting with respect to the first protective film 4 and at the same time the outer circumference of the second protective film 5 is placed at a position of 5 mm or less from the periphery of the plate 1 And a cutting area 6 is formed between the first protective film 4 and the first protective film 4 and the second protective film 5 so that this part is blasted to one side of the plate 1 After cutting the surface to a depth of about one half, the cutting is performed until the sheet 1 passes through the other surface.
机译:在由硬脆材料制成的板1上以喷砂切割所需的间隔分配多个基板2,从而在边缘3的正面和背面形成第一保护膜4和第二保护膜5。 [第二保护膜相对于第一保护膜4以喷砂切割所必需的间隔设置,同时第二保护膜5的外周位于5的位置。距板1的周边小于等于1mm的距离,并且在第一保护膜4与第一保护膜4和第二保护膜5之间形成切割区域6,使得该部分被喷砂至板1的一侧。在表面深度约一半的情况下,进行切割直到片材1穿过另一表面为止。

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