DYNAMIC MODULUS AND RESIDUAL STRESS MEASUREMENT TEST EVALUATION DEVICE USING ULTRASONIC SOUND VELOCITY DIFFERENCE

摘要

The present invention relates to a residual stress measurement system and, more particularly, to a dynamic modulus and residual stress measurement test evaluation device using an ultrasonic sound velocity difference including a portable probe having an ultrasonic probe measuring the time value of an ultrasonic wave transmitted/reflected by the specimen by the ultrasonic wave by direct contact with the specimen; an ultrasonic amplifier amplifying and transmitting the time value of the ultrasonic probe; and a terminal calculating the time value received from the ultrasonic amplifier through a microprocessor having a residual stress calculation formula and calculating and displaying the residual stress value of the specimen. The probe comprises: a jig body contacting with the specimen at the lower surface, and integrated with a lower horizontal bar having the ultrasonic probe detachably provided at a part, a upper horizontal bar functioning as a handle apart from the lower horizontal bar upward, and a vertical support bar vertically connecting and supporting the upper horizontal bar and one end of the lower horizontal bar; an ultrasonic probe detachable from the lower horizontal bar and measuring a time value by sending/receiving an ultrasonic wave to the specimen; and a connector directly connected to the ultrasonic amplifier and performing wired connection so that the time value of the ultrasonic amplifier can be transmitted to the terminal. According to the present invention, the terminal such as a mobile device such as a laptop and a tablet PC is used, instead of vibrator obtainment of a related art based on an oscilloscope, and thus a specific signal generated by the vibrator can be confirmed quickly and on site.;COPYRIGHT KIPO 2019