Sn Sn Sn ALLOY PLATING APPARATUS AND Sn ALLOY PLATING METHOD

摘要

An object of the present invention is to provide a Sn alloy plating apparatus capable of easily adjusting the concentration of Sn ions in a plating solution. The Sn alloy plating apparatus includes a plating bath 1 for immersing the insoluble anode 2 and the substrate W in a Sn alloy plating solution and an anode chamber 66 in which the Sn anode 70 is disposed and a cathode chamber A pure water supply mechanism 102 for supplying pure water to the anode chamber 66 and the cathode chamber 68 and an anode chamber 66 for supplying pure water to the anode chamber 66 and the cathode chamber 68, A methane sulfonic acid solution supply mechanism 103 for supplying a methane sulfonic acid solution containing methane sulfonic acid to the cathode chamber 68 and an Sn replenishment solution containing Sn ion and methane sulfonic acid generated in the anode chamber 66, 1 to supply the Sn replenishment solution.