ETCHING METHOD SILICON ETCHANT USED IN THE SAME AND METHOD OF MANUFACTURING SEMICONDUCTOR SUBSTRATE PRODUCT

摘要

(assignment) A silicon etching solution capable of accurately and rapidly removing silicon or the like with respect to polycrystalline silicon and / or amorphous silicon and capable of maintaining the remaining electrode members and the like without damaging them, an etching method using the same, and a semiconductor substrate product using the same . (Solution) A silicon etchant containing an anionic group and having 3 or more carbon atoms and a nitric acid and hydrofluoric acid in an aqueous medium is prepared and the silicon etchant is applied to a silicon film made of polycrystalline silicon and / or amorphous silicon to form a concave- / RTI