Polyimide Precursor Composition for Improving Adhesion Property of Polyimide Film and Polyimide Film Prepared Therefrom

摘要

The present invention provides a polyimide precursor composition which contains a polyamic acid solution manufactured by polymerizing at least one dianhydride monomer and at least one diamine monomer in an organic solvent, aromatic carboxylic acid having four or more carboxyl groups, and an antioxidant, wherein dianhydride monomer comprises an adhesive dianhydride monomer represented by the following chemical formula 1 and an elongation of a polyimide film manufactured from the same is 13% or more.