Polyimide Precursor Composition for Improving Adhesion Property of Polyimide Film and Polyimide Film Prepared Therefrom

摘要

The present invention provides a polyimide precursor composition comprising: a polyamic acid solution prepared by polymerization of at least one type of dianhydride monomer and at least one type of diamine monomer in an organic solvent; an aromatic carboxylic acid having four or more carboxyl groups; and an antioxidant, wherein the dianhydride monomer includes an adhesive dianhydride monomer represented by chemical formula 1, and a polyimide film prepared therefrom has an elongation of 13% or more.