- - Boron nitride/resin composite circuit board and circuit board including boron nitride/resin composite integrated with heat radiation plate

摘要

Provided is a boron nitride-resin composite circuit board having high heat dissipation and high reliability. Plate-shaped resin-impregnated boron nitride sintered compact having a plate thickness of 0.2-1.5 mm, comprising 30 to 85% by volume of boron nitride sintered body and 70 to 15% by volume of boron nitride particles having an average long diameter of 5 to 50 µm. 40-150 ° C. coefficient of linear thermal expansion (CTE1) in the plane direction of the resin-impregnated boron nitride sintered compact and the metal circuit of 40-150 ° C. (CTE2) in which the metal circuits of copper or aluminum are bonded to both main surfaces of A boron nitride / resin composite circuit board having a ratio (CTE1 / CTE2) of 0.5 to 2.0.